Transfer molding is a commonly used method for manufacturing plastic packages in integrated circuit technology. It involves the use of a thermosetting material that is transferred under pressure into a closed mold. Thermosets are polymers that are fluid at low temperatures and react irreversibly when heated to form a cross-linked network that cannot be melted.
The transfer molding process typically begins with the preheating of the molding compound, also known as the preform or pellet. The preform is placed in an auxiliary chamber called the transfer pot. A transfer plunger then forces the preform to flow through runners and gates into the closed cavity or cavities of the mold. The high pressure involved in the injection molding process makes transfer molding particularly suitable for parts with inserts.Whatsapp: +1 (213)2423492
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